Digital Packaging Summit 2019: Best Case Study Award for Xeikon
The 5th Annual Digital Packaging Summit, held November 11-13 at Ponte Verde Beach, Florida, was host to over 100 label and packaging executives and where Xeikon is a keynote sponsor.
The Digital Packaging Summit is an all-inclusive experience for senior managers and business executives who want to understand how current and future digital printing technology, software and solutions will impact their business and investment decisions. This summit offers strategic-level insights into what printing industry leaders should do to improve and optimize their business.
Xeikon was honored with the Best Sponsor Case Study Presentation – Label Segment. Two of Xeikon’ customers, Simon Smith of CS Labels and Tim Smith of The Label Smith delivered their unique business and application specific case studies.
We are appreciative of our customers sharing their business and application success with the DPS audience and we are equally grateful to the Digital Packaging Summit organizers from Packaging Impressions, for this coveted award.
Pictured accepting the award is Kent Wolford, Manager, Technical Marketing/Sales Support. Also pictured are Brian Ludwick and David Pesko of NAPCO.